DPC Product Introduction


The base material uses vacuum sputtering, exposure developing, electroplating processes, etc., and applies them to ceramic metalized processing, flip-chip package substrate processing, COB thin film ceramic thermal dissipation substrates, etc. Which have good adhesion, high circuit precision, and excellent thermal and electrical conductivity The main products are high-power LED thermal dissipation substrates, LED thermal dissipation modules, concentrating type solar cell substrates, passive components, and high power electronic components, etc

Dedicated ceramic integration technology and patents,
used for developing high heat dissipating LED package substrate.

The exclusive patented technology can effectively enhance the product reflectivity.

The flat solid crystal area is more suitable for the eutectic process.

The best electroplating fill technology.

Design Rules


Item Ceramic PLCC
Al2O3 AIN

Thermal conductivity(W/mk)

25

170~220

0.6~0.8

Thermal resistance(°C/W)

3.28

2.66

25

Junction temperature (°C)

81

70

115

Expansion Coefficient (ppm/K)

6.7

3.5~5.6

14~17

Reliability

Good

Good

Bad